Products & Services>R&D & Engineering
RD Direction & Position
　     Sigurd's R & D direction is to deliver cost effective & time to mass production solutions to meet our customer's today & tomorrow requirements, through the integration of:
　 RF & Power IC test technology
　
Mixed signal & Memory IC test technology
　

CIS/CCM assembly & test technology
　 Optical devices assembly and testing services.
　
Stacking Die & Advanced assembly technology
Complete Test Engineering Solutions
　
Test Development Group
　
　
1. Test board / Test fixture / Test software develop &     manufacture
　
2. Correlation test with customers
　
3. Build up production golden samples
　
4. Transfer production technology to Production Maintain Group
　
5. Low yield analysis
　
Production Engineering Group
　
　
1. Maintain daily production
　
2. Run daily production of golden samples
　
3. Equipment (tester/handler/tape&reel) maintaines
　
4. Yield monitor
　
Technical Support Group
　
　
1. CAD/CAM support
　
2. Test board layout
　
3. Test fixture
Assembly Engineering Solutions
　
System in Package Technology
　
nMulti-layer bonding
　
50µm bond pad pitch technology
　
nPackage thermal expansion control solution.
　 CIS/CCM:3M & 5M Pixel technology for cell phone.
　 Optical devices assembly and testing services.
　
nPatent
　
　
Canada, China, England, France, Germany, Japan, Taiwan.
　
Tread mark
　
　
nChina, Japan, Taiwan
　 Multi-chip stacking die with 4 layer wire bonding capability.
　
Probe Card Center
　
RF Probe Card

Note: Many to come, please contact us for details.

Revised date Q1 2007

　


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