|
|
|
|
|
|
 Full
in-house design ability
|
 |
|
|
Excellent
thermal performance
|
|
|
Highly
reliable performance
|
|
|
JEDEC
standard outlines
|
|
|
|
|
|
|
|
|
| |
PC
Cams
|
 |
| |
Camera
Phones
|
| |
Automobile
|
| |
Toys
|
| |
Scanner
|
|
|
Process flow of CIS with BOM |
|
Process
flow
|
Material
|
|
Wafer Back
Grinding
|
|
|
Wafer Saw
|
|
|
2nd Optical
Inspection
|
|
|
Die Bond
|
Epoxy, Substrate, Ceramic
|
|
Epoxy Curing
|
|
|
Wire Bond
|
Gold wire
|
|
|
|
|
|
|
|
3rd
Optical Inspection
|
|
|
Seal
|
|
|
Cure
|
|
|
Marking
|
|
|
Singulation
Saw
|
|
|
Pick and
Place
|
|
|
FVI |
|
|
Packing
|
|
|
|
|
|
•
•Moisture
Sensitivity Test: JEDEC Level 4
(30℃
60%RH 96hrs)
|
•
•Temperature
Cycle Test: JESD22-A104C (-25℃/5min~125℃/5min
500cycles)
|
•High
Temperature Storage Life: JESD22-A103C
(125℃
500hrs)
|
