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 Full
in-house design ability
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Cavity
packaging structure
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Excellent
thermal performance
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Special
package design
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JEDEC
standard outlines
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Communication
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Consumer
product, e.g.: microphone
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Tri-axis
Accelerometer
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Air
pressure sensor
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•Micro
relay
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Process flow of MEMS with BOM |
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Process
flow
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Material
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Wafer Mount
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Wafer Saw
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2nd Optical
Inspection
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3rd
Optical Inspection
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Lid
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Plating
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Sn
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Forming |
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Lead scan
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FVI
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•
•
•Moisture
Sensitivity Test: JEDEC Level 3
(30℃
85%RH 168hrs)
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•
•
•Temperature
Cycle Test: JESD22-A104C
(-65℃/5min~150℃/5min
500cycles)
|
•Pressure
Cooker: JESD22-A102-C (121℃
2 atm. 100%RH 168hrs)
|
•
•High
Temperature Storage Life:
JESD22-A103C
(150℃
1000hrs)
|
