|
|
|
|
|
|
 3x3mm
to 10x10mm package size |
 |
|
|
12
to 196 pin counts |
|
|
0.5mm
lead pitch |
|
|
Improved
thermal and electrical performance |
|
|
Pb-free
lead finish available |
|
|
Full
in house design ability |
|
|
| |
DSPs
|
 |
| |
Smart
handheld device
|
| |
ASICs
|
| |
Switches
|
|
|
Process flow of QFN with BOM |
|
Process
flow
|
Material
|
|
Wafer Back
Grinding
|
|
|
Wafer Saw
|
|
|
2nd Optical
Inspection
|
|
|
Die Bond
|
|
|
Epoxy Curing
|
|
|
Wire Bond
|
Gold wire
|
|
|
|
|
Molding
|
Mold compound
|
|
De-film
|
|
|
Marking
|
|
|
PMC
|
|
|
Strip Mount
|
|
|
Singulation
Saw
|
|
|
Pick and
Place (option)
|
PPF
|
|
Packing
|
|
|
FVI
|
|
|
Shipping
|
|
|
|
|
|
•Moisture
Sensitivity Test: JEDEC Level 3 (30℃
85%RH 168hrs)
|
•Temperature
Cycle Test: JESD22-A104C (-65℃/5min~150℃/5min
500cycles)
|
•Pressure
Cooker: JESD22-A102-C (121℃
2 atm 100%RH 168hrs)
|
•High
Temperature Storage Life: JESD22-A103C (150℃
1000hrs)
|
