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 14x14mm
and 14x20mm package size |
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80
and 100/128 pin counts |
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0.65mm
and 0.5mm lead pitch |
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Stack
die design |
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Full
in house design ability |
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Logic
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Micro-Processor
Controller
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ASIC
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DSP
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Gate
Arrays
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Process flow of QFP with BOM |
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Process
flow
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Material
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Wafer Back
Grinding
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Wafer Mount
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Wafer Saw
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2nd Optical
Inspection
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Die Bond
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Epoxy Curing
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Wire Bond
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Gold wire
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Molding
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compound
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Marking
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Sn |
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FVI
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Packing
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•Moisture
Sensitivity Test: JEDEC Level 3
(30℃
85%RH 168hrs)
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•Temperature
Cycle Test: JESD22-A104C
(-65℃/5min~150℃/5min
500cycles)
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•Pressure
Cooker: JESD22-A102-C (121℃
2 atm 100%RH 168hrs)
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•High
Temperature Storage Life: JESD22-A103C
(150℃
1000hrs)
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