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 3x3mm
to
27x27mm
package size
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•7
to
775
pin counts
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0.4mm
lead pitch
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High
through put
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Pb-free
lead finish available
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Excellent
electrical and thermal performance
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| |
•Full
in house design ability
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logic
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| |
memory
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| |
RF
module
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Process flow of LGA with BOM |
|
Process
flow
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Material
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Solder, Component
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Wafer Saw
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2nd Optical
Inspection
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3rd
Optical Inspection
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Try
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FVI
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•
•
•
•Moisture
Sensitivity Test: JEDEC
Level 3
(30℃
85%RH 168hrs)
|
•
•
•
•Temperature
Cycle Test: JESD22-A104C
(-65℃/5min~150℃/5min
500cycles)
|
•
•Pressure
Cooker: JESD22-A102-C
(121℃
2atm 100%RH 168hrs)
|
•
•
•High
Temperature Storage
Life: JESD22-A103C
(150℃
1000hrs)
|
