Introducing our cutting-edge Die Process Services (DPS), where precision meets innovation to deliver exceptional semiconductor solutions. At our core, we offer a comprehensive suite of services tailored to cater to the intricate needs of semiconductor manufacturers worldwide. From packaging testing to bare die processing, and from packaging processes to marking and testing, our DPS portfolio encompasses every facet of the die manufacturing process. Backed by decades of industry expertise and state-of-the-art technology, we are committed to providing our clients with unparalleled support and solutions, ensuring the highest standards of quality, reliability, and performance. Discover how our Die Process Services (DPS) can elevate your semiconductor manufacturing journey to new heights of success.
DPS(Die Process Services)
Our DPS integrates total solutions for "wafer grinding", "laser cutting", "laser printing", "sawing", "tape and reel" and direct shipping. At the same time, it has the capabilities of "wafer back cover lamination", "wafer back laser printing", "100% automatic optical inspection after wafer cutting", "roll-to-roll sorting", "reconstruction" and "6-sided die" Inspection and other corresponding process integration.
Backend Services
